HTC Silicone-free thermal paste 20ml
CHF 12.10 excl. VAT, plus shipping costs
Description
HTC thermal paste is recommended where efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. This thermal paste can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicon rectifiers and semiconductors, thermostats, power resistors and radiators.
Technical data
- Excellent anti-creep properties
- High thermal conductivity: 0.90 W/m.K
- Wide operating temperature range: -50 °C to +130 °C
- Low weight loss due to volatilization
- Also available as an aerosol (HTCA)
- Low toxicity
Hazard pictograms

Additional information
Dissipation thermique | ||||||||
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Data sheets
Technical data sheet_HTC | PDF(887.95 KB) |
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MSDS | PDF(179.74 KB) |
Videos
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