Silicone-free thermal compound PLUS Xtra, 700g cartridge
CHF 295.00 excl. VAT, plus shipping costs
Description
HTCPX offers the best thermal conductivity without the use of silicone-based oils. The excellent properties of HTCPX are based on the use of various ceramic metal oxide powders. These materials are electrically non-conductive to ensure that no fault currents form when the paste comes into contact with other parts of the assembly.
The product contains no silicones and therefore cannot migrate onto electrical contacts. This prevents high contact resistance, flashover and mechanical wear. Soldering problems caused by silicones will also not be a problem.
Technical data
- Excellent anti-creep properties
- Vibration-resistant, developed for gap filling applications
- Wide operating temperature range: -50 °C to +130 °C
- Excellent thermal conductivity: 3.40 W/m.K
- Low weight loss due to volatilization
- Low toxicity
Hazard pictograms
Additional information
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Data sheets
| Technical data sheet | PDF(140.64 KB) |
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| SDS-EN | PDF(237.17 KB) |
| SDS-FR | PDF(234.84 KB) |
| SDS-IT | PDF(231.95 KB) |
| SDS-GB | PDF(226.12 KB) |
Videos
We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
