Dissipation thermique

HTC silicone-free thermal paste 35ml

CHF 19.50 excl. VAT, plus shipping costs

Item no: EHTC35ML
Stock level:21 Available immediately  
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Description

HTC thermal paste is recommended where efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. This thermal paste can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicon rectifiers and semiconductors, thermostats, power resistors and radiators.

Technical data

  • Excellent anti-creep properties
  • High thermal conductivity: 0.90 W/m.K
  • Wide operating temperature range: -50 °C to +130 °C
  • Low weight loss due to volatilization
  • Also available as an aerosol (HTCA)
  • Low toxicity

Hazard pictograms

Environmentally hazardous dead fish

Additional information

Dissipation thermique
Thermal conductivity (W/mK)

0.9

Dielectric strength (kV/mm)

42

Temperature range Application

-50 °C to +130 °C

Material

Silicone-free thermal conductive pastes

Container size (ml)

35

Container

Cartridge

Manufacturer

Electrolube

LEDs

Data sheets

Technical data sheet_HTC PDF(887.95 KB)
SDS-EN PDF(233.28 KB)
SDS-FR PDF(233.34 KB)
SDS-IT PDF(229.53 KB)
SDS-GB PDF(224.12 KB)

Videos

Screen printing thermal paste

Screen printing thermal paste

We would be happy to advise you personally

Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.