LFM-48W TM-HP 14% (20-38µ) 5cc, 20g, cartridge
CHF 29.50 excl. VAT, plus shipping costs
Description
The high-quality, lead-free solder paste TM-HP (Sn3.0Ag3.0Cu)
from Almit impresses with an excellent print image and outstanding wetting properties. It fulfills the AQP requirements and allows a preheating temperature of up to 200 °C. Thanks to its stable viscosity over long periods of time, TM-HP ensures consistent printing results. It also provides effective protection against thermal damage to the flux and oxidation of the PCB surface. The flux is so reliable that the paste can be used in many applications without cleaning.
Consistent quality is a trademark of all Almit solder pastes. Only high-purity materials with a uniform grain size are processed. This guarantees a consistent consistency and ensures that exactly the same amount of paste is applied through the stencil for each printing process - no need for readjustments on the screen printer.
The patented paste composition reliably prevents solder paste from sticking in the stencil openings - even with fine and super-fine pitch structures of less than 0.5 mm. Thanks to its highly thixotropic behavior, the printed paste retains its exact shape after the stencil is lifted off. At the same time, it offers sufficient adhesive strength to hold components securely in position even at the high accelerations of modern high-speed placement machines.
Additional information
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Data sheets
| TDS | PDF(83.57 KB) |
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| SDS | PDF(237.53 KB) |
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We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
