Stannol solder paste SP6000 TSC305 Sn96,5Ag3Cu0,5 tin 500g
CHF 117.80 excl. VAT, plus shipping costs
Description
The solder paste SP6000 is part of Stannol's more sustainable greenconnect product line. The special feature: With this solder paste, more than 85 percent ofCO2 emissions can be saved compared to conventional solder pastes by using recycled solder, among other things.
The solder paste was developed for use with the alloy TSC305 (Sn96.5Ag3Cu0.5) as well as for cost-saving use with a low silver content with the alloy TSC105 (Sn98.5Ag1Cu0.5).
The REL0-certified flux also impresses in air and nitrogen atmospheres with uncompromising wetting quality on all known lead-free PCB and component coatings. The SP6000 leaves exceptionally little residue, which is also transparent and non-corrosive.
Areas of application
The solder paste SP6000 was developed for stencil printing. With the TSC105 or TSC305 alloy as solder powder in grain size 3 (25 to 45 µm) and 4 (20 to 38 µm), the SP6000 solder paste can be used in all common open and closed printing systems.
Technical data
- Solder powder from recycled solder
- more than 85 percentCO2 savings
- Very suitable for use with low silver content (TSC105)
- High contour stability, suitable for fine pitch up to 0.4 mm
- Very good proofing after the printer has been idle for a long time
- Reflow soldering process under air or nitrogen possible
- Low Mid balling on passive components due to anti-capillary effect
- Very good wetting on most surfaces
- RoHS-compliant
Additional information
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Data sheets
| TDS-EN | PDF(590.75 KB) |
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| TDS-ENG | PDF(589.28 KB) |
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We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
