Solder pastes
SC BLF04 96.5/Ag3/Cu0.5/T4 13/05H
CHF 39.40 excl. VAT, plus shipping costs
Item no:
1502141305H
In stock: Available to order
Estimated delivery time:
2 weeks
Description
The solder paste SOLDER CHEMISTRY BLF 04 has been developed for all lead-free SMT applications.
Technical data
- Excellent resistance to moisture. Very long tack
- Excellent print quality, for hours! Stable viscosity
- A low-solids paste with only 5.8% residue and 89% metal content
- The residues correspond to the RE L0 classification
- Leaves no tar-like residues in the soldering system
- Solders easily even on slightly corroded surfaces
Additional information
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Data sheets
| Technical data sheet | PDF(59.86 KB) |
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We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
