SC BLF083 96.5/Ag3/Cu0.5/T4 12/02 Can 500g

Name: SOLDER CHEMISTRY - SC BLF083 96,5/Ag3/Cu0,5/T4 12/02 Can 500g
Brand: SOLDER CHEMISTRY
SKU: 1592141202
Price: 124.80 CHF
Availability: InStock

CHF 124.80 excl. VAT, plus shipping costs

Item no: 1592141202

Stock level:1 Available immediately

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Description

The SOLDER CHEMISTRY BLF083 solder paste represents a logical evolution in response to the irreversible shift toward lead-free SMT soldering processes and customer demand for a paste that is easier to print and maintains its tackiness for an extended period—enabling manufacturers to bridge the sometimes days-long downtime between printing and assembly—while also being virtually odorless. At the same time, our “hallmarks”—i.e., minimal residues on the PCB that remain close to the solder joint after soldering, void-free solder joints, and no need for refrigerated storage—are maintained. The use of the latest types of modified plastics and rheological additives in the solder paste, the resulting excellent compatibility with lead-free alloys, and the latest findings in SMT have contributed to this further development. Careful and strict adherence to the guidelines of ISO, EN, IPC, and MIL standards was, of course, also fundamental to this. From a physical standpoint, BLF083 is a uniform mixture of a lead-free solder powder—available in all required alloys and particle sizes—with an organic, synthetic resin-based binder that complies with Class RE L0 according to DIN EN 61190-1-1 or RMA qualification.