Solder pastes

SC BLF03 96.5/Ag3/Cu0.5/T4 12/01 Tin 200g

CHF 69.80 excl. VAT, plus shipping costs

Item no: 2002141201
Stock level:2 Available immediately  
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Description

SC BLF03 is a state-of-the-art product that has been rigorously developed and is ideally suited for all so-called lead-free SMT applications. Its development is based not only on many years of experience in the SMT field, but also on careful and strict adherence to the guidelines of ISO, EN, IPC, and MIL standards. From a physical standpoint, the SC BLF03 is a uniform mixture of a lead-free soft solder powder—available in all required alloys and particle sizes—combined with an organic, synthetic resin-based binder that complies with RE L0 per J-STD 004 (F-SW32) (exceeds RMA requirements!). This makes it one of the very best “no-clean” paste types.

Technical data

  • Clear, small (4.5%) backlog, favors the "in circuit" test !
  • A true "no clean" paste
  • Contains corrosion inhibitors
  • Excellent print quality, for hours!
  • An enormously high adhesive strength
  • The best choice for "fine and super fine pitch" applications
  • Flawless soldering results with all common soldering profiles

Additional information

Solder pastes
Alloy

Pewter/silver/copper

Melting temperature (°C)

217

Flux

REL0

Grain size

4

Container

Can

Manufacturer

SOLDER CHEMISTRY

Leaded

No

Container size (g)

200

Maintenance aids
LEDs
More
Durability

26 weeks

Data sheets

Technical data sheet PDF(43.23 KB)

We would be happy to advise you personally

Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.

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Lee Hatzikiriakos

Division Manager

+41 44 931 10 53
lee.kiriakos@simpex.ch