SC BLF03 96.5/Ag3/Cu0.5/T4 12/01 Tin 200g
CHF 69.80 excl. VAT, plus shipping costs
Description
SC BLF03 is a state-of-the-art product that has been rigorously developed and is ideally suited for all so-called lead-free SMT applications. Its development is based not only on many years of experience in the SMT field, but also on careful and strict adherence to the guidelines of ISO, EN, IPC, and MIL standards. From a physical standpoint, the SC BLF03 is a uniform mixture of a lead-free soft solder powder—available in all required alloys and particle sizes—combined with an organic, synthetic resin-based binder that complies with RE L0 per J-STD 004 (F-SW32) (exceeds RMA requirements!). This makes it one of the very best “no-clean” paste types.
Technical data
- Clear, small (4.5%) backlog, favors the "in circuit" test !
- A true "no clean" paste
- Contains corrosion inhibitors
- Excellent print quality, for hours!
- An enormously high adhesive strength
- The best choice for "fine and super fine pitch" applications
- Flawless soldering results with all common soldering profiles
Additional information
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Data sheets
| Technical data sheet | PDF(43.23 KB) |
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We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
