Dissipation thermique
Chemtronics thermal paste, boron nitride, CircuitWorks®, syringe, 3.4g
CHF 18.50 excl. VAT, plus shipping costs
Item no:
CW7250
Stock:5 Available immediately
Packaging ex works:
12 piece
6+ CHF 18.50 CHF 17.50 (5%save)
12+ CHF 17.50 CHF 16.50 (10%save)
Description
CircuitWorks® Thermal Paste facilitates heat dissipation from electrical/electronic components. This heavy consistency material is thickened with a thermally conductive filler to provide a positive heat sink seal in electrical/electronic devices.
- Facilitates heat transfer between circuit components and heat sinks
- Excellent thermal and dielectric properties
- Does not dry out, does not harden and does not melt
- Non-corrosive and non-flammable
Technical data
- Offers maximum thermal conductivity with excellent dielectric properties
- Silicone-free connection does not harden or dry out
- Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
- Exceeds MIL-C-47113 for thermal conductivity
Additional information
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Data sheets
TDS | PDF(524.35 KB) |
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SDS | PDF(150.58 KB) |
We would be happy to advise you personally
Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.
