Solder pastes

SC BLF04 96.5/Ag3/Cu0.5/T4 12/02 Can 500g

CHF 123.80 excl. VAT, plus shipping costs

Item no: 1502141202
In stock: Available to order
Estimated delivery time: 2 weeks
Delivery time request  Print PDF

Description

The solder paste SOLDER CHEMISTRY BLF 04 has been developed for all lead-free SMT applications.

Technical data

  • Excellent resistance to moisture. Very long tack
  • Excellent print quality, for hours! Stable viscosity
  • A low-solids paste with only 5.8% residue and 89% metal content
  • The residues correspond to the RE L0 classification
  • Leaves no tar-like residues in the soldering system
  • Solders easily even on slightly corroded surfaces

Additional information

Solder pastes
Alloy

Pewter/silver/copper

Melting temperature (°C)

217-219

Flux

REL0

Grain size

4

Container

Can

Manufacturer

SOLDER CHEMISTRY

Leaded

No

Container size (g)

500

LEDs
More
Durability

26 weeks

Data sheets

Technical data sheet PDF(774.07 KB)

We would be happy to advise you personally

Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.

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Lee Hatzikiriakos

Division Manager

+41 44 931 10 53
lee.kiriakos@simpex.ch