Adhesives

TC 430 Thermally Conductive Adhesive 1 kg (A+B)

CHF 565.00 excl. VAT, plus shipping costs

Item no: 30633358
In stock: Available to order
Estimated delivery time: 7 weeks
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Description

  • Polytec TC 430 is a solvent-free, two-component, boron nitride-filled, epoxy thermally conductive adhesive.
  • Polytec TC 430 is a versatile adhesive for thermal management in electronics, hybrid technology, sensor technology, optronics and much more.
  • Polytec TC 430 was specially developed for the bonding of heat sinks in mass production, but is also suitable as a thermally conductive chip adhesive, underfill or as a chip cover.
  • It can be applied by dispensing or by hand.
  • Due to its non-abrasive filler, Polytec TC 430 is also suitable for processing with dynamic mixing and dosing systems.

Technical data

  • Number of components: 2
  • Curing (e.g.): 150 °C / 15 minutes
  • Temperature range: approx. -55 °C to 250 °C
  • Consistency: thixotropic pasty
  • Product information: non-abrasive, fine boron nitride filler, high glass transition value (Tg), excellent temperature stability, highly electrically insulating

Additional information

Adhesives
Product

Thermally conductive adhesive

Suitable application

Electronic components, metal, heat dissipation

Temperature range Application

-55 °C to +250 °C

Viscosity class

Thixotrope

Viscosity in mPa-s

13000

Dripping time / processing time

15 - 60 minutes

Color

Yellow

Manufacturer

Polytec PT

LEDs
More
Container size (g)

1000

Data sheets

TDS PDF(113.84 KB)

Videos

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Our technical support team will be happy to answer any questions you may have about our products. Our competent product specialists with project experience will accompany you conscientiously in your projects. It is important to us to offer our customers top service at all times.