Polytec PT GmbH develops, manufactures and distributes special adhesives for applications in electrical engineering, electronics, medical technology and optics.
The portfolio includes electrically and thermally conductive adhesives, transparent adhesives for optical applications and UV-curing adhesives based on epoxy resins, acrylates and polyurethanes.
The products are used, among other things, for the electrical contacting of components (e.g. for chip assembly or the manufacture of smart cards), the casting of temperature sensors or the bonding of optical fibers (e.g. in endoscopy). In addition to an extensive range of standard products, Polytec PT also develops and manufactures customized adhesives that are tailored to the specific requirements of each customer.
Thanks to many years of cooperation with system manufacturers, research institutes and customers, Polytec PT has extensive know-how and offers support in the selection of adhesives and in questions of process technology.
Product groups
Gap filler
Thermally conductive pastes are generally thermally conductive pastes that are highly viscous but dispensable and easy to handle. They are usually pressed between two substrates to fill gaps in order to ensure reliable heat dissipation between the respective components. Unlike adhesives, their main advantage is that they do not harden, but remain pasty throughout their service life and have a natural self-adhesion that makes them suitable for simple pre-assembly, for example. At the same time, the required detachability of the components is ensured.
Electrically conductive adhesives
In practice, electrically conductive adhesives are mainly used in connection technology to join components together in such a way that a permanent mechanical connection is created and at the same time electrical contacting of the components is ensured. In recent years, electrically conductive bonding has thus become an effective alternative to conventional joining methods such as soldering or sintering in many areas.
Epoxy resin adhesives
Epoxy resin adhesives and potting resins are widely used in many industrial applications. The materials are generally characterized by high internal strength, good adhesion to a variety of surfaces and high resistance to temperature stresses and chemical influences. The material properties in terms of flow behavior, curing speed and flexibility can be adjusted over a relatively wide range.
Thermally conductive adhesives
Thermally conductive adhesives are used in joining technology to join components together in such a way that a permanent mechanical connection is created and heat is transferred from the warmer to the colder component at the same time. In many cases, thermally conductive bonding is therefore an alternative to conventional joining methods such as soldering, welding or screwing.
UV-curing adhesives
Light-curing adhesives, or UV adhesives for short, are primarily used in joining technology where fast curing is required. These single-component products have the ability to cure at room temperature within seconds of exposure to UV light. This enables very short cycle times, even for large quantities.
Polytec PT Catalogs
Polytec PT Video
